Enhances Z elastomer
performance in the remaining applications.
Each pad can flex
independently from adjacent pads
Filled via for reliable
interconnect
Exatron provides an
exciting technology for making electrical contact
to semiconductor devices.
Flexee
Particle Interconnect (PI) contacts are ideally suited for interconnect
between surface mount devices and load boards,
testers, programmers as well as other repeat-insertion
applications. In addition, due to the superior
physical characteristics of PI, and because Flexee PI contacts exhibit the same electrical characteristics
as a solder connection, use of PI can effectively
eliminate the impedance mis-match experienced
in using conventional contactor assemblies.
Flexee
Particle Interconnect Electrical and Mechanical
Properties
• Contact
resistance under 3 milliOhms
• Capacitance approaches zero
• Inductance approaches zero
• Tested to 40 GHz
• Artwork controlled 50 ohm impedance
• Contact pressure 10 to 12 grams / contact
• Contact height as low as* 0.001””
• -70° C to +200° C temperature range
• No “wiping action” required
Flexible
Interposers materials
Teflon: Best
electrical properties (best for RF) Most Flexible
Shortest mechanical
life.
Kapton: Good
electrical properties (includes most RF) Most
popular to date 100K
contacts minimum mechanical life.
