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Select one of the
Particle Interconnect products below |
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DUO Compliant
PI Interposers |
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features: |
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Allows for
up to 0.004”/0.1mm of mechanical compliance |
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Brings “rocker
socket”-ruined DUT test boards back to life! |
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Particle Interconnect
contact surface, top & bottom |
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Total thickness
under0.010”/0.3mm |
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MLF, QFN, LCC Leadless
Packages to 0.4mm pitch |
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-70° C
to +200° C temperature range |
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Ideal for RF Test applications |
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Long life:
100K hits minimum |
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Gerber-controlled foot
print |
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Teflon,
Kapton, FR-4 material choices |
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Exatron US Patent 6,703,851 |
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Our Diamond
Particle Interconnect (PI)
contacts are ideally suited for interconnect
between surface mount devices and load boards,
testers,
programmers, as well as other repeat-insertion
applications. Exatron builds both rigid PCB and
flex circuit (interposer) test sockets. "Leaded"devices
such as SOIC, SSOIC, PLCC, QFP, work well on either
rigid PCB or interposer-style sockets. Leadless
devices, whose contact pads lack mechanical compliance,
such as MLF, LCC,QFN, have been candidates for
interposer-style sockets. Until now, these have
been only moderately successful. In some cases
a conductive elastomer was needed to provide the
necessary compliance, but with life span and electrical
performance
drawbacks. With the new DUO interposer
socket, Exatron provides an elegant solution to
the mechanical
compliance problem and maintains the best electrical
performance of any socket available today.
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click image to enlarge
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DUO
interposers are provide in sheet form or
as individual complete test sockets. Even with
just a one-piece order,
we can easily adapt the DUO interposer to fit any
rocker-type test socket footprint and tooling pin/bolt
pattern.
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