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What is Particle Interconnect?
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Exatron provides an exciting technology for making electrical contact to semiconductor devices. Diamond Particle Interconnect (PI) contacts are ideally suited for interconnect between surface mount devices and load boards, testers, programmers, as well as other repeat-insertion applications.

With a total interconnect of as low as* 0.001” between DUT lead and test circuit trace, PI is the only contactor method with effectively ZERO INDUCTANCE, CAPACITANCE and RESISTANCE, with a lifetime of up to 1 million insertions and more. In addition, due to the superior physical characteristics of PI, and because PI contacts exhibit the same electrical characteristics as a solder connection, use of PI can effectively eliminate the impedance mis-match experienced in using conventional contactor assemblies.

Particle Interconnect uses metalized diamond particles to form a micro "bed of nails" contact. The rough surface created by PI allows for zero lead length interconnect of DUT leads and test board circuits. PI pierces any contaminants on either the DUT leads or test contacts. The resulting contact has a resistance of under 3 milliOhms.

* May vary by application.
 


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